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CVE-2023-33063: Qualcomm Multiple Chipsets Use-After-Free Vulnerability

RBRecent Breaches Vulnerability Intelligence·Dec 5, 2023
High⚠ Actively exploited (CISA KEV)
High
Severity
Active
CISA KEV
No
Ransomware use
Dec 26, 2023
Patch deadline
⚠ Exploited in the wild. CISA added CVE-2023-33063 to its Known Exploited Vulnerabilities catalog on Dec 5, 2023, with a federal patch deadline of Dec 26, 2023 — meaning attackers are actively using it. If you run the affected software, patch it immediately.

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

CVE-2023-33063 is a use-after-free vulnerability affecting multiple Qualcomm chipsets. It stems from memory corruption in DSP Services that can occur during a remote call from the High-Level Operating System (HLOS) to the Digital Signal Processor (DSP). For IT and security teams, this matters because Qualcomm chipsets are widely embedded in mobile devices, IoT hardware, and other systems; successful abuse of memory-corruption flaws in this class can allow an attacker to disrupt device integrity or gain elevated control over affected components. Specifics on impact and scope must be confirmed against the vendor advisory.

How it works

This vulnerability is classified as CWE-416 (Use-After-Free). In a use-after-free condition, memory that has already been freed is subsequently referenced or written, leading to corruption. According to the available summary, the issue arises in DSP Services on multiple Qualcomm chipsets during a remote call originating from HLOS to the DSP. An attacker who can influence or trigger such a call may cause the corrupted memory state to be reused, potentially resulting in unintended behavior such as process instability or further memory-safety violations. Exact exploitation mechanics, required privileges, or attack vectors are not detailed in the provided facts and must be verified in the vendor advisory; defenders should treat this as a classic memory-corruption weakness in the DSP communication path rather than inventing specific payloads or sequences.

Am I affected? How to find it in your systems

Qualcomm chipsets appear in a broad range of consumer and enterprise devices, including smartphones, tablets, embedded systems, and networking or IoT endpoints that rely on DSP functionality for signal processing. To inventory exposure, identify hardware that uses Qualcomm silicon by reviewing device model numbers, firmware inventories, asset-management databases, or vendor-supplied hardware reports. Cross-check the specific chipset identifiers against the list of affected products in the Qualcomm advisory; do not rely on generic version ranges because the facts only state “multiple chipsets.”

How to remediate

The primary remediation is to apply the updates or patches supplied by Qualcomm or the device manufacturer that address CVE-2023-33063. Follow the CISA-required action: apply remediations or mitigations per vendor instructions, or discontinue use of the product if remediation or mitigations are unavailable. After patching, verify that the updated firmware or software is correctly installed and that DSP Services operate without residual memory-corruption symptoms. For this class of use-after-free issues, also ensure that any intermediate software layers that mediate HLOS-to-DSP calls are updated, because incomplete patching of the call path can leave residual risk. Document the applied fixes in your change-management system and re-scan inventories to confirm coverage.

If you can't patch immediately

When immediate patching is not feasible, apply compensating controls that reduce the attack surface of the DSP communication path. Segment devices containing the affected chipsets onto restricted network zones so that untrusted hosts cannot easily initiate or influence HLOS-to-DSP remote calls. If the product architecture allows, disable or restrict non-essential DSP Services features until the vendor fix can be deployed. Employ host-based or network monitoring focused on DSP-related process crashes, unexpected memory allocations, or anomalous inter-processor traffic; alert on deviations from baseline behavior. Virtual patching via a WAF or endpoint protection rule is of limited direct applicability to a chipset-level memory flaw, but any available vendor-supplied interim mitigations should be enabled. Continuously reassess the residual risk and prioritize the official update as soon as operational constraints permit.

If your data may have been exposed

Actively exploited memory-corruption vulnerabilities can lead to device compromise and subsequent data exposure. Although ransomware use of this specific CVE is not documented, any confirmed exploitation should trigger incident-response procedures, including forensic examination of affected devices and review of data that may have been accessible from the compromised DSP or HLOS context. As a quick check for known credential or personal-data exposure, readers can run a free exposure scan of their email addresses against publicly recorded breach data sets.

AICompiled with AI assistance from public sources and published under our editorial standards.

Details

AffectedQualcomm · Multiple Chipsets
WeaknessCWE-416
Added to CISA KEVDec 5, 2023
Federal patch deadlineDec 26, 2023
Known ransomware useNot documented
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Official records: NVD · CISA KEV

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